NEW DELHI: Indian Institute of Science (IISc) has proposed a groundbreaking project to develop angstrom-scale chips, positioning India as a leader in next-generation semiconductors.
A team of 30 scientists from IISc has submitted a proposal to the ministry of electronics and IT to develop the chips, which will be far smaller than the smallest chips currently in production. The project seeks Rs 500 crore funding over five years, aiming to overcome global reliance on silicon-based technologies.
The team has submitted the proposal to the govt for developing technologies using a new class of semiconductor materials, called 2D Materials, that could enable chip sizes as small as one-tenth of the smallest chips currently in global production.
Angstrom-scale chips could unlock groundbreaking advancements across multiple industries. With significantly higher transistor density, these chips could enable AI models to process vast amounts of data faster and more efficiently, revolutionizing fields like quantum computing and Al-driven automation.
Currently, semiconductor manufacturing is dominated by silicon-based technologies, led by advanced nations such as the US, Japan, South Korea, and Taiwan. The smallest chip currently in production is the 3-nanometer node, manufactured by companies like Samsung and MediaTek. A human hair typically has a thickness of 1,00,000 nanometres (0.01 cm) or 10,00,000 angstrom.
India currently relies heavily on foreign players for semiconductor manufacturing — a technology that is strategic from both an economic and national security standpoint.
The country’s largest semiconductor project, being set up by Tata Electronics in partnership with Taiwan’s PSMC, involves an investment of Rs 91,000 crore. Compared to this project, the IISc proposal requests a relatively modest Rs 500 crore over five years to build indigenous technology for next-generation semiconductors. The project also includes a roadmap for self-sustainability after the initial funding phase.